Abstract:

Objective: To explore the safety and effectiveness of diode laser in the second-stage implant surgery. Methods: A total of 168 patients with single implant in our hospital who need to undergo second-stage implant surgery were selected and randomly divided into two groups(diode laser group and scalpel group), with 84 cases in each group. The diode laser group used diode laser for the second-stage implant surgery, and the scalpel group used traditional scalpel for the second-stage implant surgery. The anesthesia, intraoperative blood loss, postoperative visual analogue scale (VAS) scores, and the model-taking time were compared. Result: Most patients in diode laser group only needed surface anesthesia, but most patients in scalpel group needed supplemental infiltration anesthesia after using surface anesthesia. The intraoperative blood loss, postoperative VAS scores and the model-taking time in diode laser group were better than those in scalpel group with significantly statistical difference(P<0.05). Conclusion: In the second-stage implant surgery performed with diode laser, most patients only need surface anesthesia, with less bleeding, no sutures, less postoperative pain, and faster gum healing time, and the method provides an additional option for the second-stage implant surgery.

Key words: diode laser, second-stage of implant surgery

摘要： 目的: 探讨半导体激光在种植二期手术使用中的安全性及有效性。方法: 选取我院168例需要行种植二期手术的单颗种植体患者，将患者随机分为半导体激光组和手术刀组，每组各84例，半导体激光组采用半导体激光行种植二期手术，手术刀组采用传统手术刀行种植二期手术，比较2组患者的麻醉情况、术中出血量、术后疼痛视觉模拟评分法（visual analogue scale，VAS）的评分及取模时间。结果: 半导体激光组大部分患者仅使用表面麻醉即可，手术刀组大部分患者在使用表面麻醉后还需补充浸润麻醉。半导体激光组术中出血量、术后VAS评分、取模时间均优于手术刀组，差异有统计学意义（P<0.05）。结论: 利用半导体激光行种植二期手术时，大部分患者仅需行表面麻醉，且术中出血少、术后疼痛小、伤口无须缝合、牙龈愈合快，该方法为种植二期手术多提供了一种选择。

关键词: 半导体激光, 种植二期手术

CLC Number: 

• R782